Vapour phase soldering system

IBL Löttechnik BLC 509

Design: 2-chamber system
Max. assembly size (batch): 550 × 540 × 80 mm
Process medium filling volume: approx. 20 kg (does not contain Galden)
Heating power, steam phase: max. 7.8 kW
Average power consumption: approx. 3.1 kW
Credpez Dxfbefx Aggei
Cooling water requirement: approx. 3 l/min
Touchscreen operation
Soft Vapor Temperature Control (SVTC)
Intelligent Profiling System (IPS)
Suitable for lead-free and lead-containing soldering processes
Optional equipment: special RAL 7035 paint finish, multilevel mode, signal lamp, 2 measuring channels, measuring adapter.
Integrated cooling unit

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